Radiation-hardened Test Design for Aerospace SoC

Dan‐dan Cheng, Dan Qi, Mo Chen
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Abstract

Due to space application scenarios, radiation hardening techniques should be applied on aerospace SoC. This paper introduces an integrated test method for radiation-hardened SoC, which combines traditional scan chain and Memorybist designs, and new TMD chain and RAM test designs to verify the performance of rad-hardened SoC. The design of scan chain and Memorybist can be applied to the rapid screening of chips after tapeout. TMD chain and RAM test can verify the radiation-hardened performance of the chip in radiation experiments. The whole test design is flexible and configurable with high test coverage, and it is helpful to analyze the malfunction and radiation resistance of the chip.
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航空SoC抗辐射测试设计
由于空间应用的需要,辐射硬化技术应应用于航天SoC。本文介绍了一种集成测试方法,该方法将传统的扫描链和Memorybist设计与新的TMD链和RAM测试设计相结合,以验证抗辐射SoC的性能。扫描链和Memorybist的设计可以应用于取片后芯片的快速筛选。TMD链和RAM测试可以在辐射实验中验证芯片的抗辐射性能。整个测试设计灵活可配置,测试覆盖率高,有助于分析芯片的故障和抗辐射性能。
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