Modeling and analysis of dual-arm cluster tools for wafer fabrication with revisiting

Yan Qiao, N. Wu, Mengchu Zhou
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引用次数: 6

Abstract

Some wafer fabrication processes are repeated processes, e.g. atomic layer deposition (ALD) process. For such processes, the wafers need to visit some processing modules for a number of times, which complicates the cycle time analysis. This paper studies the cycle time analysis problem for such processes. With a Petri net model, it is found that such processes contain local cycles involving only the revisiting PMs and global cycles involving both revisiting and non-revisiting PMs. The process switches between these two types of cycles such that the process never reaches a steady state. Based on this finding, the mechanism underlying such processes is revealed and analytical expressions are given for the calculation of their cycle time. Illustrative examples are presented to show the application of the proposed approach.
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基于重访的双臂集束工具建模与分析
一些晶圆制造工艺是重复工艺,如原子层沉积(ALD)工艺。对于这种工艺,晶圆需要多次访问某些加工模块,这使得周期时间分析变得复杂。本文研究了这类过程的周期时间分析问题。利用Petri网模型,发现该过程包含只涉及重访pm的局部周期和涉及重访pm和非重访pm的全局周期。过程在这两种类型的循环之间切换,因此过程永远不会达到稳定状态。基于这一发现,揭示了这一过程的机制,并给出了计算其循环时间的解析表达式。举例说明了该方法的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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