Efficient RF-PA Two-Chip Supply Modulator Architecture for 4G LTE and 5G NR Dual-Connectivity RF Front-End

Ji-Seon Paek, Dongsu Kim, Jae-Yeol Han, Younghwan Choo, Jongwoo Lee
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引用次数: 3

Abstract

This paper presents a two-chip supply modulation architecture for efficient RF power amplification using a fully switched-mode supply modulator (SM) and a linear-assisted hybrid SM to support simultaneous transmission on LTE and 5G bands. The designed fully switched-mode SM consists of a fast buck converter and a slow buck converter, and it achieves 88.2% peak efficiency with a low RX band noise of -140dBm/Hz at the SM output. The designed 5G NR SM, consisting of a class-AB linear amplifier (LA) and an interleaved 3-level buck-boost converter provides a 150-MHz 3-dB bandwidth for tracking the 100-MHz envelope signal. An optimal RF-PA supply deployment using the two SMs efficiently supports multiple RF-PA loads while satisfying the dual transmission requirements of E-UTRAN New Radio Dual-Connectivity (EN-DC) and 5G 100-MHz ET operation.
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用于4G LTE和5G NR双连接射频前端的高效RF- pa双芯片电源调制器架构
本文提出了一种双芯片供电调制架构,使用全开关模式供电调制器(SM)和线性辅助混合SM来实现有效的射频功率放大,以支持LTE和5G频段上的同时传输。所设计的全开关模式SM由一个快降压转换器和一个慢降压转换器组成,在SM输出端实现了88.2%的峰值效率和-140dBm/Hz的低RX波段噪声。设计的5G NR SM由ab类线性放大器(LA)和交错3电平降压-升压转换器组成,提供150-MHz 3-dB带宽,用于跟踪100-MHz包络信号。使用两个SMs的最佳RF-PA电源部署有效地支持多个RF-PA负载,同时满足E-UTRAN新无线电双连接(EN-DC)和5G 100-MHz ET操作的双传输要求。
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