MPC strategies for multi-beam mask writers

I. Bork, P. Buck
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引用次数: 3

Abstract

The benefit of complex and curvilinear mask shapes as well as the demand for fast mask production cycles has been driving the development of Multi-Beam Mask Writers (MBMW) for several years. Meanwhile, those writers have reached a quality level where they can be integrated into mask production flows at various nodes and even be used for writing imprint lithography templates at wafer scale. 50 keV e-beam writers whether Multi-Beam or Variable Shaped Beam (VSB), are affected by scattering effects at various length scales and require significant corrections in order to print mask features on target. Correction methods for long-range effects such as PEC (Proximity Effect Correction) and FEC (Fogging Effect Correction) have been developed for VSB machines and can be applied to MBMWs in the same way. Similarly, long-range mask process effects like loading (LEC) can be corrected using the same methods as developed for VSB machines. Besides long-range scattering and etch effects, critical masks for the 14 nm technology node and below are affected by short-range scattering and etch effects like e-beam forward scattering and etch micro-loading. Those effects increase at length scales below several 100 nm and change printed CDs significantly at minimum feature sizes on DUV and EUV masks where SRAFs are targeted around 60 nm and 30 nm, respectively. Figure 1 (left) shows an example of a typical mask CD error signature where the range of CD errors from small, isolated features to large nested features can easily cover 15 nm or more. Those short range distortions are generally corrected using so called Mask-Process-Correction (MPC) tools which compensate mask errors by moving edges of the input design and optionally adjust the dose of printed features locally. Simulated mask contours before and after MPC are shown in Figure 1 (center, right) demonstrating the large effect of MPC on SRAFs but also the non-negligible effect on main feature CDs, especially on line-ends and narrow lines.
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多波束掩码编写器的MPC策略
复杂和曲线掩模形状的好处以及对快速掩模生产周期的需求多年来一直推动着多波束掩模编写器(MBMW)的发展。同时,这些书写器已经达到了一个质量水平,可以集成到各个节点的掩模生产流程中,甚至可以用于在晶圆规模上书写压印模板。无论是多波束还是变形波束(VSB), 50 keV电子束写入器都受到不同长度尺度散射效应的影响,并且需要进行大量校正才能在目标上打印掩模特征。远距离效应的校正方法,如PEC(接近效应校正)和FEC(雾化效应校正)已经为VSB机器开发,可以以同样的方式应用于mbws。同样,可以使用与VSB机器开发的相同方法来纠正加载(LEC)等远程掩模过程影响。除了远程散射和蚀刻效应外,14 nm及以下技术节点的关键掩模还受到电子束前向散射和蚀刻微加载等短程散射和蚀刻效应的影响。这些效应在小于100纳米的长度尺度下会增加,并且在DUV和EUV掩模上的最小特征尺寸下会显著改变打印cd,其中srf的目标分别为60纳米和30纳米。图1(左)显示了一个典型掩模CD错误特征的示例,其中CD错误的范围从小的、孤立的特征到大的嵌套特征,可以很容易地覆盖15 nm或更大。这些短距离失真通常使用所谓的掩模-过程校正(MPC)工具进行校正,该工具通过移动输入设计的边缘来补偿掩模误差,并可选择在局部调整打印特征的剂量。MPC前后的模拟掩模轮廓如图1(中右)所示,显示了MPC对srf的巨大影响,以及对主要特征cd的不可忽略的影响,特别是在线端和窄线上。
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