J. Koehl, U. Baur, T. Ludwig, Bernhard Kick, Th. Pflueger
{"title":"A flat, timing-driven design system for a high-performance CMOS processor chipset","authors":"J. Koehl, U. Baur, T. Ludwig, Bernhard Kick, Th. Pflueger","doi":"10.1109/DATE.1998.655874","DOIUrl":null,"url":null,"abstract":"We describe the methodology used for the design of the CMOS processor chipset used in the IBM S/390 Parallel Enterprise Server-Generation 3. The majority of the logic is implemented by standard cell elements placed and routed flat, using timing-driven techniques. The result is a globally optimized solution without artificial floorplan boundaries. We show that the density in terms of transistors per mm/sup 2/ is comparable to the most advanced custom designs and that the impact of interconnect delay on the cycle time is very small. Compared to custom design, this approach offers excellent turn-around-time and considerably reduces overall effort.","PeriodicalId":179207,"journal":{"name":"Proceedings Design, Automation and Test in Europe","volume":"75 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-02-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings Design, Automation and Test in Europe","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DATE.1998.655874","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14
Abstract
We describe the methodology used for the design of the CMOS processor chipset used in the IBM S/390 Parallel Enterprise Server-Generation 3. The majority of the logic is implemented by standard cell elements placed and routed flat, using timing-driven techniques. The result is a globally optimized solution without artificial floorplan boundaries. We show that the density in terms of transistors per mm/sup 2/ is comparable to the most advanced custom designs and that the impact of interconnect delay on the cycle time is very small. Compared to custom design, this approach offers excellent turn-around-time and considerably reduces overall effort.