An accurate power and temperature simulation framework for Network-on-Chip

Jianxun Yang, Shan Cao
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引用次数: 3

Abstract

With the CMOS technology node decreasing rapidly, many homogeneous and heterogeneous cores are enabled to be integrated onto a single chip in order to improve the performance of chips. However, due to the aggressive technology scaling, following the improvement of system integration, the rise of power density increases rapidly, which causes a significant number of hot spots and poses an enormous threat to the performance and lifetime of chips. For better modulation of this problem, an accurate temperature simulation platform is urgently necessary. In this paper, based on the open-source Gem5, McPAT and Hotspot simulators, a novel simulation framework is built for accurate power and temperature simulation of Network-on-Chips. Gem5 is adopted to simulate the specified CPU model and obtained access statistics. McPAT and Hotspot are utilized to estimate the power and temperature of the corresponding architecture, respectively. Afterwards, a set of temperature-aware dynamic task scheduling algorithms are then conducted to evaluate the performance of the proposed simulation framework.
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片上网络的精确功率和温度仿真框架
随着CMOS技术节点的迅速减少,为了提高芯片的性能,可以将许多同质和异构内核集成到单个芯片上。然而,由于激进的技术规模化,随着系统集成度的提高,功率密度的上升迅速增加,产生了大量的热点,对芯片的性能和寿命构成了巨大的威胁。为了更好地解决这一问题,迫切需要一个精确的温度模拟平台。本文基于开源的Gem5、McPAT和Hotspot模拟器,构建了一种新的仿真框架,用于对片上网络进行精确的功耗和温度仿真。采用Gem5对指定的CPU模型进行模拟,得到访问统计信息。利用McPAT和Hotspot分别估算相应架构的功耗和温度。然后,通过一组温度感知的动态任务调度算法来评估所提出的仿真框架的性能。
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