{"title":"Bump non-wet issue in large-die flip chip package with eutectic Sn/Pb solder bump and SOP substrate pad","authors":"Z. Xiong, Ho Pei Sze, K. H. Chua","doi":"10.1109/EPTC.2004.1396648","DOIUrl":null,"url":null,"abstract":"This paper describes a study on non-wet issue encountered in flip chip assembly process of high-density flip chip ball grid array (FCBGA) packages with eutectic Sn/Pb solder interconnects. A nonwet occurrence is more obvious in large-die flip chip (die size >16mm) with high I/O counts (>1000). Thermal-mechanical mismatch between die and substrate shows a role in affecting soldering condition of the die solder bump and substrate SOP. Positive evaluation results, involving: 1) new flux material with increased percentage of solid content or modified activator and 2) plasma treatment on substrate prior to FC assembly, indicate that a more effective approach is needed to improve bump solderability in large die flip chip devices","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2004.1396648","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
This paper describes a study on non-wet issue encountered in flip chip assembly process of high-density flip chip ball grid array (FCBGA) packages with eutectic Sn/Pb solder interconnects. A nonwet occurrence is more obvious in large-die flip chip (die size >16mm) with high I/O counts (>1000). Thermal-mechanical mismatch between die and substrate shows a role in affecting soldering condition of the die solder bump and substrate SOP. Positive evaluation results, involving: 1) new flux material with increased percentage of solid content or modified activator and 2) plasma treatment on substrate prior to FC assembly, indicate that a more effective approach is needed to improve bump solderability in large die flip chip devices
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