J. Hejase, S. Chun, W. Becker, D. Dreps, B. Beaman
{"title":"A hybrid land grid array socket connector design for achieving higher signalling data rates","authors":"J. Hejase, S. Chun, W. Becker, D. Dreps, B. Beaman","doi":"10.1109/EPEPS.2017.8329761","DOIUrl":null,"url":null,"abstract":"This paper presents an improved hybrid land grid array socket connector design enabling high speed bus signaling data rates up to 50Gb/s. Observed limitations in an existing connector such as impedance mismatches and crosstalk are treated and improved. The improved connector structural differences from the existing connector are presented and motivated. Electromagnetic modelling for the improved and existing connectors has been carried out to validate the design concept and compare signal integrity properties.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2017.8329761","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
This paper presents an improved hybrid land grid array socket connector design enabling high speed bus signaling data rates up to 50Gb/s. Observed limitations in an existing connector such as impedance mismatches and crosstalk are treated and improved. The improved connector structural differences from the existing connector are presented and motivated. Electromagnetic modelling for the improved and existing connectors has been carried out to validate the design concept and compare signal integrity properties.
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