Investigation of Effect to Mechanical Strength of Additive Powder Type into Adhesive

Abstract

A B S T R A C T The objective of this study is to investigate the capability of adhesive with adding aluminium powder and 63/37 Sn-Pb soft solder powder and copper powder to the epoxy to increase the mechanical strength of joints. The adhesive strength of the joints was determined by utilizing the single-lap shear test. Experimental results show that joints prepared by adhesive which was modified, adding 5 wt% 63/37 Sn-Pb powder have more mechanical strength than joints compared to ones which were prepared by adding aluminium powder and copper powder with ratio as 5 wt%.