New LITESURF plating for the mitigation of whisker risks in press-fit applications

2017 IEEE Holm Conference on Electrical Contacts Pub Date : 2017-09-01 DOI:10.1109/HOLM.2017.8088075

E. R. Crandall, F. Schabert, H. Schmidt, M. Bleicher, Thomas Fili, Walter Fischer, Claus Borhauer, S. Thoss, J. Villarreal, Bart Kerckhof

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引用次数: 4

Abstract

Due to restrictions on lead usage often resulting in the use of pure tin deposits, coupled with global miniaturization, the unpredictable risks of Sn whisker growth rises, especially in highly stressed coating applications. The ability to prevent whisker growth is particularly important for the growing implementations of solderless press-fit pin connections, where although very beneficial, produce high stress gradient conditions on the compliant pin's coating, leading to higher risks of whisker induced failures. Therefore, TE Connectivity has developed a new production level tin-whisker free technology through the application of an electroplated Bismuth (Bi) based deposit (LITESURF), tailored for reliable press-fit pin connections with the ability to accommodate for further miniaturization trends. In this work we discuss the properties of LITESURF plating and its universal use in various PCBs (iSn, iAg and OSP) along with how it is a promising tin alternative for press-fit applications, which can reduce the risk of whisker growth related failures by orders of magnitude.

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新型LITESURF电镀，用于减轻压合应用中的晶须风险

由于限制铅的使用往往导致使用纯锡矿床，再加上全球小型化，锡晶须生长的不可预测风险上升，特别是在高应力涂层应用中。防止晶须生长的能力对于越来越多的无焊压合销连接来说尤为重要，尽管这种连接非常有益，但在符合要求的销的涂层上产生高应力梯度条件，导致晶须引起故障的风险更高。因此，TE Connectivity通过应用电镀铋(Bi)基镀层(LITESURF)开发了一种新的生产级无锡晶须技术，该技术专为可靠的压合引脚连接而设计，能够适应进一步小型化的趋势。在这项工作中，我们讨论了LITESURF电镀的特性及其在各种pcb (iSn, iAg和OSP)中的普遍应用，以及它如何成为压合应用中有前途的锡替代品，它可以将晶须生长相关故障的风险降低几个数量级。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2017 IEEE Holm Conference on Electrical Contacts

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