{"title":"Low temperature Cu-Cu thermocompression bonding assisted by electrochemical desorption of a self-assembled monolayer","authors":"Tamal Ghosh, V. Krishna, S. Singh","doi":"10.1109/ICEMELEC.2014.7151165","DOIUrl":null,"url":null,"abstract":"This paper reports low temperature Cu-Cu thermocompression bonding with the help of self-assembled monolayer (SAM) desorption. SAM layer protects copper from oxidation. It should be desorbed just before bonding. The desorption was carried out using cyclic voltammetry in aqueous potassium hydroxide (KOH) solution. Contact angle measurements carried out before and after desorption indicates successful desorption of SAM. The bonding was carried out at 150 °C and has yielded in excellent bond strength of 520 N.","PeriodicalId":186054,"journal":{"name":"2014 IEEE 2nd International Conference on Emerging Electronics (ICEE)","volume":"121 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE 2nd International Conference on Emerging Electronics (ICEE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEMELEC.2014.7151165","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper reports low temperature Cu-Cu thermocompression bonding with the help of self-assembled monolayer (SAM) desorption. SAM layer protects copper from oxidation. It should be desorbed just before bonding. The desorption was carried out using cyclic voltammetry in aqueous potassium hydroxide (KOH) solution. Contact angle measurements carried out before and after desorption indicates successful desorption of SAM. The bonding was carried out at 150 °C and has yielded in excellent bond strength of 520 N.
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