Glass interposer integrated millimeter wave antennas for inter-/intra chip communications

Y. Yoon, Seahee Hwangbo, Arian Rahimi, Sheng-Po Fang, T. Schumann
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引用次数: 1

Abstract

Millimeter wave antennas are integrated in the glass interposer layer for wireless inter-/intra chip/board communications. For in-plane communication, a disc loaded monopole antenna with an omni-directional radiation pattern is designed while for out-of plane communication, a similar architecture with patch mode radiation is configured. These antennas are useful for wireless interconnects in three dimensional integrated systems in package.
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玻璃中间层集成了毫米波天线,用于芯片间/芯片内通信
毫米波天线集成在玻璃中间层中,用于无线芯片间/芯片内/板间通信。对于平面内通信,设计了具有全向辐射方向图的圆盘加载单极子天线;对于平面外通信,配置了具有贴片模式辐射的类似结构。这些天线可用于封装三维集成系统的无线互连。
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