Development of Ultrahigh-Speed InP/GaAsSb/InP DHBTs: Are Terahertz Bandwidth Transistors Realistic?

C. Bolognesi, H. Liu, O. Ostinelli, Y. Zeng
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引用次数: 1

Abstract

In response to the continually increasing appetite for bandwidth, most transistor technologies have recently made great strides towards higher cutoff frequencies: Silicon MOSFETs, SiGe HBTs, InP-based HEMTs and a variety of InP -based HBTs all show cutoff frequencies fT and/or fMAX exceeding 300 GHz, and in some cases approaching 800 GHz. Proponents of various technologies have stated that the development of THz bandwidth devices is an attainable milestone for their technology of choice. Such ambitious goals naturally raise the question of whether such performances are in fact realistic given the well-known trends relating breakdown voltages and cutoff frequencies. Can the contending technologies be scaled in a way enabling THz cutoff frequencies while maintaining the well-behaved characteristics of less aggressively scaled previous generations? The present Invited Paper focuses on our efforts to push InP/GaAsSb DHBTs toward THz bandwidths.
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超高速InP/GaAsSb/InP dhbt的发展:太赫兹带宽晶体管现实吗?
为了响应对带宽不断增长的需求,大多数晶体管技术最近都朝着更高的截止频率取得了长足的进步:硅mosfet、SiGe hbt、基于InP的hemt和各种基于InP的hbt的截止频率fT和/或fMAX都超过300 GHz,在某些情况下接近800 GHz。各种技术的支持者已经表示,太赫兹带宽设备的发展是他们选择的技术可实现的里程碑。这样雄心勃勃的目标自然会提出这样的问题:考虑到众所周知的与击穿电压和截止频率相关的趋势,这样的性能实际上是否现实?这些竞争技术能否在保持前几代产品的优良特性的同时,实现太赫兹截止频率的扩展?本邀请论文重点介绍了我们将InP/GaAsSb dhbt推向太赫兹带宽的努力。
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