{"title":"Integrated free-space optical interconnects for chip-to-chip communications","authors":"J. Jahns","doi":"10.1109/MPPOI.1998.682122","DOIUrl":null,"url":null,"abstract":"Free-space optics can help alleviate the communications problems of electronic computers by its large spatial and temporal bandwidth. For compact packaging, the concept of planar-integrated free-space optics is used. Here, we give an overview of the design, fabrication and thermal management of planar optical interconnects.","PeriodicalId":248808,"journal":{"name":"Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MPPOI.1998.682122","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14
Abstract
Free-space optics can help alleviate the communications problems of electronic computers by its large spatial and temporal bandwidth. For compact packaging, the concept of planar-integrated free-space optics is used. Here, we give an overview of the design, fabrication and thermal management of planar optical interconnects.
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