Research on TSV Thermal-mechanical Reliability Based on Finite Element Analysis

Abstract

Three-dimensional integrated packaging technology is recognized as the fourth generation packaging technology with the hope of breaking Moore's law. And through silicon via(TSV) technology is the key of three-dimensional packaging technology. In order to study the thermal-mechanical reliability of TSV structure, the finite element method was used to simulate the equivalent stress and deformation of TSV with different TSV size, aspect ratio, pitch and structure. The distribution of equivalent stress and deformation was obtained. The simulation results showed that the increase of TSV size would lead to the increase of equivalent stress and deformation, the aspect ratio of TSV would only affect deformation, and the increase of TSV pitch would lead to the decrease of equivalent stress and the increase of deformation. In addition, TSV filled with parylene was analyzed in this paper. The stress could be effectively released by increasing the size of parylene.