Global Digital-Analog Co-Simulation Methodology for Power and Signal Integrity aware Design and Analysis

S. Wane, G. Boguszewski
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引用次数: 3

Abstract

In this paper a global co-simulation methodology for concurrent/simultaneous analysis of passive and active analog/digital parts is proposed. An original power-signature concept is introduced to model high-speed digital modules temporal and spatial distribution of their power switching activity through specified chip partitions. Dedicated real-world NXP-Philips-Semiconductors active modules mounted on test-board have been designed and measured for validation of the proposed co-simulation methodology. Full-wave electromagnetic modeling, broadband SPICE compact model extractions and measurement results are successfully compared.
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功率和信号完整性感知设计与分析的全球数模联合仿真方法
本文提出了一种用于无源和有源模拟/数字部件并发/同步分析的全局联合仿真方法。引入了一种原始的功率签名概念来模拟高速数字模块通过指定芯片分区的功率开关活动的时间和空间分布。已经设计和测量了安装在测试板上的专用实际NXP-Philips-Semiconductors有源模块,以验证所提出的联合仿真方法。全波电磁建模、宽带SPICE紧凑模型提取与测量结果成功对比。
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