Qualification and application of pressure-less sinter silver epoxy

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference Pub Date : 2016-09-01 DOI:10.1109/IEMT.2016.7761938

Loh Kian Hwa, Nadzirah Yahya, Chin Siew Kheong, Lee Ken Hok

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Abstract

Semiconductor industry is getting momentum to use pressure sinter silver to replace solder on high power application due to need to replace the lead in the solder. But pressure sinter silver epoxy requires heavy investment on the pressure molding and oven cure equipment. The existing pressure sinter silver is also need to dedicated to identified package type and this will causing the package flexibility concern. So, we would like to explore the pressure-less sinter silver epoxy. There are already many paper presented by the semiconductor industry and research centre and still a lots of work need to done in order to qualify this pressure-less sinter silver epoxy. In this paper, we will discuss the collaboration work between supplier and customer to qualify this pressure-less sinter silver epoxy. Now we are understand the behavior of this pressure-less sinter silver epoxy and can predict the application to suit this epoxy.

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无压烧结环氧银的鉴定及应用

由于需要取代焊料中的铅，半导体行业在大功率应用中使用压力烧结银代替焊料的势头正在增强。但压力烧结银环氧树脂需要大量投资压力成型和烘箱固化设备。现有的压烧结银还需要专用于确定的封装类型，这将引起封装灵活性的担忧。因此，我们想探索无压烧结银环氧树脂。半导体工业和研究中心已经发表了许多论文，但为了验证这种无压烧结环氧银，还有很多工作要做。在本文中，我们将讨论供应商和客户之间的合作工作，以确定这种无压力烧结环氧银。现在我们已经了解了这种无压烧结银环氧树脂的性能，并可以预测其应用。

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2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference

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