Demonstration of GaN Impact Ionization Avalanche Transit-Time (IMPATT) Diode

D. Ji, B. Ercan, Jia Zhuang, Lei Gu, J. Rivas-Davila, S. Chowdhury
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引用次数: 4

Abstract

Wide bandgap semiconductors, such as gallium nitride (GaN) and silicon carbide (SiC), have bandgap energies larger than 3 eV with high breakdown electric fields, showing the advantage on powerful IMPATT diodes. SiC IMPATT diodes have been successfully demonstrated and shown excellent performances in X-band applications [1] , [2] . Although a few theoretical studies have shown the great potential of GaN for powerful IMPATT diodes [3] , [4] , no experimental study has been reported so far. Taking advantage of the single crystalline GaN substrates enabling high quality GaN films, avalanche capability has been demonstrated [5] – [9] . In this study, we demonstrated a GaN-based IMPATT diode experimentally by using a n-i-p epitaxial structure grown on a bulk GaN substrate.
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GaN冲击电离雪崩传递时间(IMPATT)二极管的演示
宽禁带半导体,如氮化镓(GaN)和碳化硅(SiC),具有大于3 eV的带隙能量和高击穿电场,显示出强大的IMPATT二极管的优势。SiC IMPATT二极管已经成功地在x波段应用中展示了优异的性能[1],[2]。虽然一些理论研究已经显示了GaN在强大的IMPATT二极管中的巨大潜力[3],[4],但到目前为止还没有实验研究的报道。利用单晶GaN衬底实现高质量GaN薄膜,雪崩能力已被证明[5]-[9]。在这项研究中,我们通过在大块GaN衬底上生长的n-i-p外延结构实验证明了基于GaN的IMPATT二极管。
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