Characteristics of Triple Material Gate AlGaN/GaN High Electron Mobility Transistor

Md Tashfiq Bin Kashem, S. Subrina
{"title":"Characteristics of Triple Material Gate AlGaN/GaN High Electron Mobility Transistor","authors":"Md Tashfiq Bin Kashem, S. Subrina","doi":"10.1109/ICAEE.2015.7506867","DOIUrl":null,"url":null,"abstract":"A two dimensional simulation study has been executed to explore the characteristics of a newly proposed AlGaN/GaN High Electron Mobility Transistor (HEMT) device with triple material gate (TMG) structure. Surface potential and electric field distribution along the device channel are comprehensively examined and compared with those of dual material gate (DMG) and single material gate (SMG) HEMT. TMG HEMT shows better suppression of drain induced barrier lowering (DIBL) and hot carrier effect (HCE) due to the formation of two steps screening effect in channel potential and less amount of electric field peak at the drain terminal. Effect of different device parameters e.g. individual channel length related to different gate material, total channel length and externally applied voltage on the surface potential and electric field are also explored and proper choice of the device parameters and bias voltages is optimized to improve device performance, achieve high speed and reduce short channel effects (SCE) effectively.","PeriodicalId":123939,"journal":{"name":"2015 International Conference on Advances in Electrical Engineering (ICAEE)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 International Conference on Advances in Electrical Engineering (ICAEE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICAEE.2015.7506867","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

A two dimensional simulation study has been executed to explore the characteristics of a newly proposed AlGaN/GaN High Electron Mobility Transistor (HEMT) device with triple material gate (TMG) structure. Surface potential and electric field distribution along the device channel are comprehensively examined and compared with those of dual material gate (DMG) and single material gate (SMG) HEMT. TMG HEMT shows better suppression of drain induced barrier lowering (DIBL) and hot carrier effect (HCE) due to the formation of two steps screening effect in channel potential and less amount of electric field peak at the drain terminal. Effect of different device parameters e.g. individual channel length related to different gate material, total channel length and externally applied voltage on the surface potential and electric field are also explored and proper choice of the device parameters and bias voltages is optimized to improve device performance, achieve high speed and reduce short channel effects (SCE) effectively.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
三材料栅极AlGaN/GaN高电子迁移率晶体管的特性
采用二维仿真方法研究了一种新型三材料栅极(TMG)结构AlGaN/GaN高电子迁移率晶体管(HEMT)器件的特性。并与双材料栅极(DMG)和单材料栅极(SMG) HEMT的表面电位和沿器件通道的电场分布进行了比较。TMG HEMT对漏极势垒降低(DIBL)和热载子效应(HCE)有较好的抑制作用,这是由于通道电位形成了两级筛选效应,漏极端的电场峰量较少。探讨了不同器件参数(如与不同栅极材料相关的单个沟道长度、总沟道长度、外加电压对表面电位和电场的影响)对器件性能的影响,优化了器件参数和偏置电压的合理选择,从而有效地提高了器件性能,实现了高速率,有效地减少了短沟道效应(SCE)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Problem analysis and probable solution of existing interconnected grid system of Chittagong region Development of an LCL filter for a residential Microgrid system Hardware implementation of grid connected transformer-less semi-Z-source inverter topology to mitigate common mode leakage current and THD Earthquake monitoring and warning system The next generation of irrigation
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1