A 125mV 2ns-access-time 16Kb SRAM design based on a 6T hybrid TFET-FinFET cell

H. Afzali-Kusha, A. Shafaei, M. Pedram
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引用次数: 1

Abstract

This paper proposes a robust and energy-efficient hybrid TFET-FinFET 6T SRAM cell which takes advantage of the higher ON/OFF current ratio of TFETs compared to that of FinFETs to reliably hold and access data at ultra-low supply voltages. More precisely, in the proposed hybrid cell, to achieve low static currents along with high noise margins, TFETs are used for cross-coupled inverters, and to speed up the access time, high-performance FinFETs are utilized for access transistors. The paper also presents a dual-Vt 6T SRAM, in which low-power (high-Vt) and high-performance (low-Vt) FinFETs are used for cross-coupled inverters and access transistors, respectively. For both SRAM cells, the Vdd boost read-assist technique is employed to improve the read stability. Characteristics of both SRAMs are analyzed using HSPICE simulations for technologies with the gate length of 20 nm for a 128\times 128 SRAM array. Simulation results reveal that the lowest operating Vdd for the dual-Vt cell is 225 mV, whereas that of the hybrid cell is 125 mV. Moreover, to further decrease the access delay of the hybrid cell for 125 mV ≤ Vdd ≤ 225 mV, negative Gnd read-assist technique and a boosted voltage for the row decoder are used. Finally, the paper presents a 125mV 2ns-access-time 16Kb SRAM array based on the proposed hybrid TFET-FinFET SRAM cell.
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基于6T混合TFET-FinFET单元的125mV 2ns访问时间16Kb SRAM设计
本文提出了一种鲁棒和节能的混合TFET-FinFET 6T SRAM单元,它利用tfet比finfet更高的ON/OFF电流比,在超低电源电压下可靠地保持和访问数据。更准确地说,在提出的混合单元中,为了实现低静态电流和高噪声余量,将tfet用于交叉耦合逆变器,并且为了加快访问时间,将高性能finfet用于访问晶体管。本文还介绍了一种双vt 6T SRAM,其中低功率(高vt)和高性能(低vt) finfet分别用于交叉耦合逆变器和接入晶体管。对于这两个SRAM单元,采用了Vdd boost读辅助技术来提高读稳定性。对于栅极长度为20 nm的128 × 128 SRAM阵列,采用HSPICE模拟分析了这两种SRAM的特性。仿真结果表明,双vt电池的最低工作电压为225 mV,而混合电池的最低工作电压为125 mV。此外,为了进一步降低混合单元在125 mV≤Vdd≤225 mV时的接入延迟,采用了负Gnd读取辅助技术和行解码器升压。最后,本文提出了一个基于TFET-FinFET混合SRAM单元的125mV 2ns访问时间16Kb SRAM阵列。
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