{"title":"\"Watts\" the matter: power reduction issues","authors":"A. Correale","doi":"10.1109/EPEP.2001.967599","DOIUrl":null,"url":null,"abstract":"Technology continues to shrink lithographic images producing smaller chips which require lower voltages. The lower voltage has helped the overall power dissipation per device, but the number of devices that can be integrated has increased by a faster rate. The result is often power-constrained designs. To help alleviate the explosion in power, designers have been faced with many design challenges. Clock power management is now the norm with multiple operation modes. On-board dynamic frequency adjustment and temperature detectors are now employed to ensure that the product does not exceed its maximum thermal limits. Another aspect of power management is the use of multiple voltages. The author discusses power management from a packaging perspective and concludes that power efficiency has become a mandate for success.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"148 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967599","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Technology continues to shrink lithographic images producing smaller chips which require lower voltages. The lower voltage has helped the overall power dissipation per device, but the number of devices that can be integrated has increased by a faster rate. The result is often power-constrained designs. To help alleviate the explosion in power, designers have been faced with many design challenges. Clock power management is now the norm with multiple operation modes. On-board dynamic frequency adjustment and temperature detectors are now employed to ensure that the product does not exceed its maximum thermal limits. Another aspect of power management is the use of multiple voltages. The author discusses power management from a packaging perspective and concludes that power efficiency has become a mandate for success.
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“瓦茨”的问题:功率降低问题
技术继续缩小光刻图像,生产更小的芯片,需要更低的电压。较低的电压有助于降低每个器件的总体功耗,但可以集成的器件数量却以更快的速度增加。其结果往往是功率受限的设计。为了缓解电力爆炸,设计师们面临着许多设计挑战。时钟电源管理现在是多种操作模式的标准。现在采用板载动态频率调节和温度探测器,以确保产品不超过其最大热限制。电源管理的另一个方面是使用多个电压。作者从封装的角度讨论了电源管理,并得出结论,电源效率已成为成功的必要条件。
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