{"title":"Ada electronic combat modeling","authors":"Kurt D. Welker, M. W. Snyder, Jerry A. Goetsch","doi":"10.1145/260303.260308","DOIUrl":null,"url":null,"abstract":"A liquefiable peroxide reactive molding composition comprising a reaction product of a polyol, an organic polyisocyanate and a hydroxyl ethylenic containing compound, said liquifiable composition having a free NCO content of less than about 0.3% by weight and an organic peroxide and being useful as an injection molding composition and as an adhesive that is essentially insensitive to atmospheric moisture.","PeriodicalId":297156,"journal":{"name":"Addendum to the proceedings on Object-oriented programming systems, languages, and applications","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Addendum to the proceedings on Object-oriented programming systems, languages, and applications","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/260303.260308","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
A liquefiable peroxide reactive molding composition comprising a reaction product of a polyol, an organic polyisocyanate and a hydroxyl ethylenic containing compound, said liquifiable composition having a free NCO content of less than about 0.3% by weight and an organic peroxide and being useful as an injection molding composition and as an adhesive that is essentially insensitive to atmospheric moisture.
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