Impact of hot carrier on RF N-LDMOS reliability for radar application after pulsed life test

M. A. Belaid
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Abstract

This Study presents a bench is dedicated to high RF power device lifetime tests under RF pulses for radar application. This bench combined the stress tests (RF, electrical and thermal,) applied to devices and have a direct impact on their lifetime. A complete device electric characterization (I-V, C-V and RF) has been conducted before/after different temperatures (3000 hours at 150° C and 10° C), and material clarifications for the phenomenon of failure, the reliability of different tests was compared. The prevailing physical acoustics concerned were studied and validated using the Silvaco-Atlas simulator. The main objective is to find a relationship between the electrical parameters degradation to failed physical phenomena caused by impact ionization. The degradation of N-LDMOS performance is tied to the hot carriers (traps) and trapped electrons, which leads to the accumulation of negative charge in the Si/SiO2 interface. More interface states (i.e. important buildup of negative charge) are created at low temperature due to impact ionization phenomenon. This is the reason why the electrical degradations are so high at 10°C.
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脉冲寿命试验后热载流子对雷达应用射频N-LDMOS可靠性的影响
本研究提出了一个用于雷达射频脉冲下高功率器件寿命测试的实验台。该工作台结合了应用于设备的压力测试(RF,电和热),并对其使用寿命产生直接影响。在不同温度(150℃和10℃下3000小时)前后进行了完整的器件电特性(I-V, C- v和RF),并对失效现象进行了材料说明,比较了不同试验的可靠性。使用Silvaco-Atlas模拟器对相关的主流物理声学进行了研究和验证。主要目的是找出电学参数退化与冲击电离引起的失效物理现象之间的关系。N-LDMOS性能的下降与热载流子(陷阱)和被困电子有关,这导致Si/SiO2界面中负电荷的积累。由于冲击电离现象,在低温下产生了更多的界面态(即负电荷的重要积累)。这就是为什么在10°C时电降解率如此之高的原因。
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