{"title":"Interpolating inductance coupling effects for package and PCB simulation","authors":"Xin Xu, W. Thiel, J. Bracken","doi":"10.1109/EPEPS.2017.8329744","DOIUrl":null,"url":null,"abstract":"A simple interpolating formula is proposed to model the frequency dependent inductance coupling effect between parallel plate and stripline modes. It requires only DC and high-frequency results of a transmission line. These results can be obtained more efficiently as compared to a general wide band 2D full wave simulation algorithm such as FEM or MOM. Numerical tests show that the proposed method agrees reasonably well with 2D full wave simulation","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2017.8329744","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A simple interpolating formula is proposed to model the frequency dependent inductance coupling effect between parallel plate and stripline modes. It requires only DC and high-frequency results of a transmission line. These results can be obtained more efficiently as compared to a general wide band 2D full wave simulation algorithm such as FEM or MOM. Numerical tests show that the proposed method agrees reasonably well with 2D full wave simulation
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