Development of Double Pancake Manufacturing Technology for ITER TF Coil

M. Iguchi, H. Kajitani, K. Takano, S. Ando, Y. Uno, K. Matsui, N. Koizumi, M. Nakahira, E. Fujiwara, K. Sakaguchi, T. Hamada
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引用次数: 1

Abstract

Synopsis : The ITER Toroidal Field (TF) coil radial plate (RP) is the main structure of a double pancake (DP), and a TF conductor is inserted into the RP groove and affixed using cover plates (CPs). Since the RP and CPs are used at around 4 K and should sustain huge electromagnetic force, full-austenite stainless steel (SS) is used. Furthermore, high-power laser-beam welding (LBW) is applied for welding during RP assembly and RP-CP welding with the aim of minimizing welding deformation and achieving very tight dimensional tolerances. In addition, cold-drawing is applied in CP fabrication for high production efficiency. Combining full-austenite SS and LBW normally generates welding defects and cold-drawing deteriorates fracture toughness. These technical issues have been overcome by introducing the following technical developments. A 75-mm-thick high-power LBW is obtained without defect by optimizing the chemical composition of the RP base metal. A yield stress (YS) of 900 MPa and fracture toughness (K IC ) of 180 MPam 0.5 can be achieved for both the base metal and weld joint at 4 K. In addition, the cold-drawing process for straight CP was optimized to achieve the required YS and K IC through process control and intermediate relevant mechanical testing. Furthermore, optimal LBW conditions for wide-gap weld joints, such as 0.5 mm and 0.7 mm, were developed for RP-CP and CP-CP welding, respectively. Applying these techniques to the fabrication process during RP, CP, and CP welding, optimized manufacturing procedures have been successfully developed to achieve the technical requirements. In addition, these fabrication procedures are well rationalized to satisfy schedule requirements in ITER. Accordingly, series production of RP and CP, and CP welding has commenced, and is proceeding. As of May, 2020, 61 RPs and 50 CP welding out of 63 have been successfully completed.
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ITER TF线圈双煎饼制造技术的发展
简介:ITER环形场(Toroidal Field, TF)线圈径向板(radial plate, RP)是双煎饼(DP)的主体结构,TF导体插入RP槽内,用盖板(盖板)固定。由于RP和cp在4 K左右使用,并且应该承受巨大的电磁力,因此使用全奥氏体不锈钢(SS)。此外,在RP装配和RP- cp焊接过程中,大功率激光束焊接(LBW)被应用于焊接,目的是最小化焊接变形并达到非常严格的尺寸公差。此外,为了提高生产效率,还采用了冷拔工艺。全奥氏体SS与LBW结合通常会产生焊接缺陷,冷拔会降低断裂韧性。通过引入以下技术发展,已经克服了这些技术问题。通过优化RP母材的化学成分,获得了厚度为75 mm的无缺陷大功率LBW。在4k时,母材和焊缝的屈服应力(YS)可达900 MPa,断裂韧性(IC)可达180 MPam 0.5。此外,通过过程控制和中间相关力学测试,优化了直CP冷拔工艺,达到了要求的YS和K IC。在此基础上,研究了RP-CP和CP-CP大间隙焊接时0.5 mm和0.7 mm的最佳焊厚条件。将这些技术应用于RP, CP和CP焊接的制造过程中,成功地开发了优化的制造工艺,以达到技术要求。此外,这些制造过程都很好地合理化,以满足ITER的进度要求。因此,RP和CP的批量生产和CP焊接已经开始,并正在进行中。截至2020年5月,已成功完成61个rp和50个CP焊接。
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