A novel concept for RF-system-in-package high volume production measurements

Abstract

Today more and more multifunction RF-SIP (System-In-Package) modules, in SMD (Surface-Mount-Technology) package style, come into high volume production phase. There are many challenges in automatic RF measurements of RF-SIP-SMD devices. Each different SIP must have dedicated load-board that contains multiple RF connectors as well as a rigorous RF considerations and design. Furthermore, RF test equipment with complicated calibration of high frequency transmission path is needed. The module described in this paper is a multifunction Doppler detector based of silicon chip packaged in standard QFN molding process. It contains internal VCO, down-converter, active IF-filter and active IF amplifier. This work presents the development and application for testing a high volume production, using a novel load-board that makes RF test equipment and RF calibrations unnecessary. All measurable parameters are translated to analog DC voltages in a smart and pre-calibrated way. This makes the RF-SIP-SMD measurements easier and one can set voltage limits, low and high, by a simple digital voltmeter connected directly to a computer. Limits can be changed easily according to desired SIP performance, in purpose to decide if the measured device is “PASS” or “FAIL”.