Integrating Drain Gating and Lector Techniques for Leakage Power Reduction in Ultra Deep Submicron Technology

Thokala Harikrishna, Sanchita, Shivam Kumar, A. Jain
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引用次数: 2

Abstract

Due to scaling short channel effects are observed in devices under ultra deep submicron technology. The short channel effects causes leakage current to flow through the transistor which increases static power dissipation of the circuits. In this work two popular leakage reduction techniques namely drain gating technique and lector technique are combined to reduce the leakage power reduction of CMOS VLSI circuits. Different logic circuits are simulated using this novel combined technique for different input vectors. The performance of inverter and NOR gate are analyzed in terms of dc power dissipation and propagation delay and are compared with the existing popular leakage reduction techniques. Due to combined effect of drain gating and lector techniques, substantial reduction in leakage power is observed. The proposed technique reduces the leakage power consumption of Drain gating NOR gate by 44% and Lector NOR gate by 22% for 45nm technology.
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集成漏极门控和收集器技术在超深亚微米技术中降低泄漏功率
在超深亚微米技术下,由于尺度效应,器件中出现了短通道效应。短通道效应导致漏电流流过晶体管,从而增加了电路的静态功耗。本文将两种常用的漏极门控技术和集电极技术相结合,以降低CMOS VLSI电路的漏功率。针对不同的输入向量,采用这种新颖的组合技术对不同的逻辑电路进行了仿真。从直流功耗和传输延迟两个方面分析了逆变器和NOR门的性能,并与现有流行的减漏技术进行了比较。由于漏极门控和收集器技术的联合作用,泄漏功率显著降低。对于45nm技术,该技术可将漏极通通NOR栅极的泄漏功耗降低44%,将电极NOR栅极的泄漏功耗降低22%。
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