Paper study on thermal conductivity of Al2O3 thin film of different thicknesses on copper substrate under different contact pressures

Abstract

Thermal interface resistance of solids is an important factor for heat conduction from one solid to another. Interface resistance disrupts heat flow in systems like CPUs and various solid state devices like LEDs. Interface materials play an important role in heat transport through interface. In this study, Al203 with different thickness was coated on a copper substrate. The overall thermal conductivity of the material is measured at different contact pressures. It was observed that overall thermal conductivity of the system was affected by thickness of the Al2O3. It was also observed that the overall thermal conductivity increases with increasing pressure.