GaN-based quasi-vertical Schottky barrier diodes with the sidewall field plate termination for obtaining low leakage current and high breakdown voltage

Fuping Huang, Chunshuang Chu, Yonghui Zhang, Kangkai Tian, Xingyu Jia, Han Peng, Zi-hui Zhang
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Abstract

In this work, we demonstrate and fabricate a GaN-based quasi-vertical Schottky barrier diode (SBD) with the sidewall field plate structures (SFP) on sapphire substrate. The fabricated SFP-SBD with a 3 μm drift layer exhibits excellent reverse blocking characteristics, e.g., the low leakage current is maintained at ~ 10-9 A/cm2 until hard breakdown occurs, and the breakdown voltage (BV) can reach ~ 420 V. The enhanced reverse blocking characteristics can be well attributed to the decreased local strong electric field at Schottky contact interface and electrode edge with the help of SFP structures. Meanwhile, the simulation results present that the thick field plate insulator, e.g., 1 μm SiO2 in this work, can share a large part electric field from the Schottky contact interface in the condition of high reverse bias, which well reduces the leakage current. Moreover, the SFP structure does not make a markable degradation for the forward conduction characteristics, e.g., a turn-on voltage (Von) of ~ 0.6 V and a specific on-resistance (Ron. sp) of ~ 10 mΩ•cm2 can also be obtained for the fabricated SFP-SBD in this work.
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基于gan的准垂直肖特基势垒二极管,其侧壁场极板端接可获得低泄漏电流和高击穿电压
在这项工作中,我们展示和制造了一个基于gan的准垂直肖特基势垒二极管(SBD),其侧壁场板结构(SFP)在蓝宝石衬底上。具有3 μm漂移层的SFP-SBD具有优异的反阻特性,在发生硬击穿之前,泄漏电流保持在~ 10-9 a /cm2,击穿电压(BV)可达~ 420 V。在SFP结构的帮助下,减少了Schottky接触界面和电极边缘的局部强电场,从而增强了反向阻挡特性。同时,仿真结果表明,厚场板绝缘子(如1 μm SiO2)在高反向偏置条件下,可以共享来自肖特基接触界面的大部分电场,可以很好地降低泄漏电流。此外,SFP结构不会显著降低正向传导特性,例如,导通电压(Von)为~ 0.6 V和特定导通电阻(Ron)。sp)为~ 10 mΩ•cm2。
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