When “things” get older: Exploring circuit aging in IoT applications

Xinfei Guo, Vaibhav Verma, Patricia Gonzalez-Guerrero, M. Stan
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引用次数: 10

Abstract

The Internet of Things (IoT) brings a paradigm where humans and “things” are connected. Reliability of these devices becomes extremely critical. Circuit aging has become a limiting factor in technology scaling and a significant challenge in designing IoT systems for reliability-critical applications. As IoT becomes a general-purpose technology which starts to adapt to the advanced process nodes, it is necessary to understand how and on what level aging affects different categories of IoT applications. Since aging is highly dependent on operating conditions and switching activities, this paper classifies the IoT applications based on the aging-related metrics and studies aging using the foundry-provided FinFET aging models. We show that for many IoT applications, aging will indeed add to the already tight design margin. As the expected chip lifetime in IoT devices becomes much longer and the failure tolerant requirements of these applications become much more strict, we conclude that aging needs to be considered in the full design cycle and the IoT lifetime estimation needs to incorporate aging as an important factor. We also present application-specific solutions to mitigate circuit aging in IoT systems.
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当“事物”变老:探索物联网应用中的电路老化
物联网(IoT)带来了人与“物”连接的范式。这些设备的可靠性变得极其关键。电路老化已成为技术扩展的限制因素,也是为可靠性关键型应用设计物联网系统的重大挑战。随着物联网成为一种通用技术,并开始适应先进的过程节点,有必要了解老化如何以及在什么程度上影响不同类别的物联网应用。由于老化高度依赖于操作条件和开关活动,因此本文基于老化相关指标对物联网应用进行分类,并使用代工厂提供的FinFET老化模型研究老化。我们表明,对于许多物联网应用,老化确实会增加本已紧张的设计余量。随着物联网设备中预期的芯片寿命变得越来越长,这些应用的容错要求变得越来越严格,我们得出结论,老化需要在整个设计周期中考虑,物联网寿命估计需要将老化作为一个重要因素。我们还提出了特定应用的解决方案,以减轻物联网系统中的电路老化。
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