Inducing Thermal-Awareness in Multicore Systems Using Networks-on-Chip

David Atienza Alonso, E. Martinez
{"title":"Inducing Thermal-Awareness in Multicore Systems Using Networks-on-Chip","authors":"David Atienza Alonso, E. Martinez","doi":"10.1109/ISVLSI.2009.25","DOIUrl":null,"url":null,"abstract":"Technology scaling imposes an ever increasing temperature stress on digital circuit design due to transistor density, especially on highly integrated systems, such as Multi-Processor Systems-on-Chip (MPSoCs). Therefore,temperature-aware design is mandatory and should be performed at the early design stages. In this paper we present a novel hardware infrastructure to provide thermal control of MPSoC architectures, which is based on exploiting the No interconnects of the baseline system as an active component to communicate and coordinate between temperature sensors scattered around the chip, in order to globally monitor the actual temperature. Then, a thermal management unit and clock frequency controllers adjust the frequency and voltage of the processing elements according to the temperature requirements at run-time. We show experimental results of the infrastructure to implement effective global temperature control policies for a real-life 4-core MPSoC,emulated on an FPGA-based emulation framework.","PeriodicalId":137508,"journal":{"name":"2009 IEEE Computer Society Annual Symposium on VLSI","volume":"30 21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Computer Society Annual Symposium on VLSI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISVLSI.2009.25","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13

Abstract

Technology scaling imposes an ever increasing temperature stress on digital circuit design due to transistor density, especially on highly integrated systems, such as Multi-Processor Systems-on-Chip (MPSoCs). Therefore,temperature-aware design is mandatory and should be performed at the early design stages. In this paper we present a novel hardware infrastructure to provide thermal control of MPSoC architectures, which is based on exploiting the No interconnects of the baseline system as an active component to communicate and coordinate between temperature sensors scattered around the chip, in order to globally monitor the actual temperature. Then, a thermal management unit and clock frequency controllers adjust the frequency and voltage of the processing elements according to the temperature requirements at run-time. We show experimental results of the infrastructure to implement effective global temperature control policies for a real-life 4-core MPSoC,emulated on an FPGA-based emulation framework.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
利用片上网络诱导多核系统的热感知
由于晶体管密度的原因,技术规模对数字电路设计施加了不断增加的温度压力,特别是在高度集成的系统上,如多处理器片上系统(mpsoc)。因此,温度感知设计是强制性的,应该在设计的早期阶段进行。在本文中,我们提出了一种新的硬件基础设施来提供MPSoC架构的热控制,该基础设施基于利用基线系统的无互连作为主动组件,在分散在芯片周围的温度传感器之间进行通信和协调,以便全局监测实际温度。然后,热管理单元和时钟频率控制器根据运行时的温度要求调整处理元件的频率和电压。我们展示了在基于fpga的仿真框架上对现实生活中的4核MPSoC实施有效全局温度控制策略的基础设施的实验结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A Novel Low Area Overhead Body Bias FPGA Architecture for Low Power Applications Synchronization-Based Abstraction Refinement for Modular Verification of Asynchronous Designs A Low-power Low-cost Optical Router for Optical Networks-on-Chip in Multiprocessor Systems-on-Chip Maximally Redundant High-Radix Signed-Digit Adder: New Algorithm and Implementation Overview of the Scalable Communications Core: A Reconfigurable Wireless Baseband in 65nm CMOS
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1