Research on Reliability Degradation Model of SnAgCu Solder Joint under Three-coupling Stress Based on Weibull Distribution and Multidimensional Data

Abstract

Based on the big data of solder joint degradation and failure under the coupling action of thermal, electrical, and mechanical stress, a three-parameter Weibull distribution failure probability model of SnAgCu solder joint is established to solve the mapping problem between different failure modes and different failure probability distribution of solder joint. The creep and degradation trend of solder joint reliability under three-stress coupling is analyzed by finite element analysis method, and the fatigue and minimum life model of solder joint with progressive excitation of interconnecting fault are presented. Using a multidimensional data-driven algorithm, the characterization and feature extraction of failure state of SnAgCu solder joint based on degradation sensitivity and salience model is presented to identify and excavate the internal laws and relations between the reliability level of the solder joint and the three-coupling stress. The semi-physical simulation shows that the reliability degradation model can effectively predict solder joint health.