Improvement of electrical performance of anisotropically conductive adhesives

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI:10.1109/ISAPM.2005.1432079

Yi Li, K. Moon, C. Wong

{"title":"Improvement of electrical performance of anisotropically conductive adhesives","authors":"Yi Li, K. Moon, C. Wong","doi":"10.1109/ISAPM.2005.1432079","DOIUrl":null,"url":null,"abstract":"To improve the electrical properties of the anisotropically conductive adhesive (ACA) joints with the potential for fine pitch interconnect, self-assembled monolayer (SAM) compounds are introduced to treat nano silver (Ag) fillers. Thermogravimetric analyzer (TGA), differential scanning calorimeter (DSC), contact angle and photoacoustic Fourier transfer infrared (FTIR) results indicated the SAMs were well coated on the nano Ag particles. Furthermore, these SAM-treated ACAs were thermally stable at processing temperatures of the ACA samples. By introducing the novel SAM materials into the interfaces between nano metal fillers and the substrate bond pads, the conductivity and current carrying capability of ACAs were improved significantly due to the stronger bonding between nano fillers and SAM and consequently the improved interface properties of the high performance ACA. The improved electrical performance of nano Ag filled ACAs was accompanied with the higher thermal conductivity as well.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2005.1432079","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

Abstract

To improve the electrical properties of the anisotropically conductive adhesive (ACA) joints with the potential for fine pitch interconnect, self-assembled monolayer (SAM) compounds are introduced to treat nano silver (Ag) fillers. Thermogravimetric analyzer (TGA), differential scanning calorimeter (DSC), contact angle and photoacoustic Fourier transfer infrared (FTIR) results indicated the SAMs were well coated on the nano Ag particles. Furthermore, these SAM-treated ACAs were thermally stable at processing temperatures of the ACA samples. By introducing the novel SAM materials into the interfaces between nano metal fillers and the substrate bond pads, the conductivity and current carrying capability of ACAs were improved significantly due to the stronger bonding between nano fillers and SAM and consequently the improved interface properties of the high performance ACA. The improved electrical performance of nano Ag filled ACAs was accompanied with the higher thermal conductivity as well.

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

各向异性导电胶粘剂电性能的改进

为了改善各向异性导电胶(ACA)接头的电学性能，引入自组装单层(SAM)化合物处理纳米银(Ag)填料。热重分析仪(TGA)、差示扫描量热仪(DSC)、接触角和光声傅立叶转移红外(FTIR)测试结果表明，纳米Ag粒子表面包覆了良好的SAMs。此外，这些经过sam处理的ACAs在ACA样品的加工温度下是热稳定的。通过将新型的SAM材料引入到纳米金属填料与衬底键合垫之间的界面中，由于纳米填料与SAM之间的键合更强，从而改善了高性能ACA的界面性能，从而显著提高了ACAs的导电性和载流能力。纳米银填充ACAs的电性能得到改善，导热系数也随之提高。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.

自引率

0.00%

发文量