E. Randel, A. Davenport, A. Markosyan, R. Bassiri, M. Fejer, C. Menoni
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引用次数: 0
Abstract
Ion beam sputtered films typically have high compressive stress. By using high energy primary ions to sputter a SiO2 target and high energy ions from an assist source with an O2 plasma the compressive stress of SiO2 can be significantly reduced down to 62MPa.
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