{"title":"Packaging technologies for highly integrated 77 GHz automotive radar sensors","authors":"M. Mayer, K. Baur, T. Walter","doi":"10.23919/eumc.2009.5296534","DOIUrl":null,"url":null,"abstract":"The availability of SiGe with transit frequencies exceeding 200 GHz enables highly integrated and cost effective 77 GHz radar sensors for automotive applications. A major challenge for future radar generations is the development of an appropriate packaging technology. We propose a system in package approach (SIP) utilizing a SMD package without external 77 GHz connections. Beamforming is possible with dielectric lenses permitting the use of this modular concept in different automotive applications.","PeriodicalId":232128,"journal":{"name":"2009 European Microwave Conference (EuMC)","volume":"200 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 European Microwave Conference (EuMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/eumc.2009.5296534","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
The availability of SiGe with transit frequencies exceeding 200 GHz enables highly integrated and cost effective 77 GHz radar sensors for automotive applications. A major challenge for future radar generations is the development of an appropriate packaging technology. We propose a system in package approach (SIP) utilizing a SMD package without external 77 GHz connections. Beamforming is possible with dielectric lenses permitting the use of this modular concept in different automotive applications.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
