An accelerated life evaluation method of microsystems using temperature and vibration stresses

Abstract

An accelerated life assessment method of microsystems products which consisted of mechanical and electrical components was studied in this paper. The temperature and vibration were chosen to be accelerated life stress according to the research result about the main failure factors of Microsystems. The way using stepwise tests to obtain the accelerated stress limits of temperature and vibration was researched. And how to get the accelerated life model under temperature and vibration stress integrated was also discussed, which gave a guideline of life evaluation of Microsystems.