{"title":"Effects of ultrasonic bonding parameters on reliability of flip chip GaN-based light emitting diode","authors":"Lianqiao Yang, F. Yuan, Jianhua Zhang","doi":"10.1007/S11741-011-0734-3","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":169010,"journal":{"name":"Journal of Shanghai University (English Edition)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Shanghai University (English Edition)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/S11741-011-0734-3","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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