The effect of ceramic metallization process on the performance of vacuum interrupter

Guoyue Zhang, Mingli Wen, Min Li, Xiaoqin Wang, Rong Yu
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引用次数: 1

Abstract

The effect of ceramic metallization process on the performance of vacuum interrupter was researched by X-ray thickness test, metallographic analysis, tensile strength test and air tightness test. Electroplating Ni and coating Ni metallization processes were used in this research. The thickness of electroplating Ni is 3.5μm-6μm, and that of coating Ni is 4μm-6μm. The Ni layers of electroplating Ni and coating Ni are both continuous, but electroplating Ni is not uniform. A little Ni layer can be seen from electroplating Ni ceramic after vacuum brazing. The tensile strength difference of standard tensile pieces between them is little. The air tightness difference of vacuum interrupter between them is not obvious.
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陶瓷金属化工艺对真空灭流器性能的影响
通过x射线厚度试验、金相分析、拉伸强度试验和气密性试验,研究了陶瓷金属化工艺对真空断流器性能的影响。本研究采用了电镀镍和镀层镍金属化工艺。电镀Ni的厚度为3.5μm-6μm,镀层Ni的厚度为4μm-6μm。电镀镍和镀层镍的Ni层都是连续的,但电镀镍不是均匀的。真空钎焊后电镀镍陶瓷表面有少量镍层。它们之间的标准拉伸件抗拉强度差异很小。两种真空灭弧器的气密性差异不明显。
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