A. Lamminen, M. Lahti, David del Río, J. Säily, J. F. Sevillano, V. Ermolov
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引用次数: 6
Abstract
The paper presents the characterization of interconnects for D-band on multilayer high frequency PCBs. The losses demonstrated at 150 GHz for a microstrip line, a coplanar waveguide and a single flip-chip transition are 1.9 dB/cm, 1.8 dB/cm and 0.3 dB (for 60 µm bumps), respectively. The applicability of multilayer high frequency PCB technology as a low cost integration platform for D-band is proven.
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