RDIDI: Recognition of Defect Image Detection in Industry

Xusen Lang, Chenyao Bai, Yunlong Zhu
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Abstract

Electronic consumer products are closely related to life. With the increase of demand, various consumer electronic products have emerged as the times require. For some high-precision equipment, such as in all aspects of the chip manufacturing process, the requirements for PCB are relatively high. In the PCB manufacturing process, it is often due to various problems caused by improper operation of certain links in the process. Many defects may appear on the PCB, such as bubbles appearing when the film is not firmly attached to the ground during the film attachment process, and bubbles appear during the exposure process. Negative film scratches, excessive pressure during etching, unevenness during plating, etc. Printed board surface defects vary in size. This inconsistency of multi-scale features will cause the pooling operation of the network model to lose some fine-grained spatial features. In the field of object detection, in the past, the detection effect in the field of PCB defect detection was poor, and the natural defects were few and small, and faced some bottlenecks in engineering. Aiming at this problem, a PCB defect detection method based on RDIDet is proposed. The experimental results prove that the improved network has obvious performance advantages over the previous classic model, with an accuracy rate of 98.3%, and a better detection effect on PCB defects.
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RDIDI:工业缺陷图像检测识别
电子消费产品与生活息息相关。随着需求的增加,各种消费电子产品应运而生。对于一些高精度的设备,比如在芯片制造过程的各个环节,对PCB的要求都比较高。在PCB制造过程中,往往是由于过程中某些环节操作不当造成的各种问题。PCB上可能会出现很多缺陷,比如贴膜过程中贴膜未牢固贴地时出现气泡,曝光过程中出现气泡等。底片划伤,蚀刻时压力过大,电镀时不均匀等。印制板表面缺陷大小不一。这种多尺度特征的不一致性会导致网络模型的池化操作失去一些细粒度的空间特征。在物体检测领域,过去在PCB缺陷检测领域的检测效果较差,天然缺陷少而小,在工程上面临一些瓶颈。针对这一问题,提出了一种基于RDIDet的PCB缺陷检测方法。实验结果证明,改进后的网络与之前的经典模型相比具有明显的性能优势,准确率达到98.3%,对PCB缺陷的检测效果更好。
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