{"title":"Interactions between Vias and the PCB Power-Bus","authors":"G. Heinrich, S. Dickmann","doi":"10.1109/EMCZUR.2009.4783439","DOIUrl":null,"url":null,"abstract":"In this paper, a method for the investigation of the interactions between a via and a PCB power-bus is described. Starting with an initial via model and two types of de-embedding algorithm, which extract the scattering parameters of the via, the elements of the via model are derived. After that the influence of the via on the power-bus impedance and the interactions between the via and the power-bus are described.","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCZUR.2009.4783439","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In this paper, a method for the investigation of the interactions between a via and a PCB power-bus is described. Starting with an initial via model and two types of de-embedding algorithm, which extract the scattering parameters of the via, the elements of the via model are derived. After that the influence of the via on the power-bus impedance and the interactions between the via and the power-bus are described.
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