A Drain-side Gate-underlap I-MOS (DGI-MOS) transistor as a label-free biosensor for detection of charged biomolecules

N. Kannan, M. J. Kumar
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引用次数: 3

Abstract

Electronic devices are finding increasing application as biosensors for the label-free detection of biomolecules. These biosensors offer the advantage of fast detection and compatibility with existing CMOS processes that enable rapid commercialization, and achieve very low detection limits. A biosensor's sensitivity is one of the main factors determining its performance. The application of emerging steep sub-threshold devices as biosensors is being actively explored due to their ability to provide very high sensitivities. In this paper, we propose the application of a Drain-side Gate-underlap Impact-ionization MOS (DGI-MOS) transistor as a sensor for label-free detection of charged biomolecules. The DGI-MOS biosensor is implemented by introducing an underlap in the gate electrode over the channel region at the drain side. The underlap serves as the location for the immobilization of biomolecules. With TCAD simulations, we demonstrate the proposed DGI-MOS biosensor to have a high sensitivity to the presence of charged biomolecules. In addition, the threshold voltage (VT) shift observed due to the presence of biomolecules is observed to be significantly higher than the other reported steep sub-threshold device-based biosensors. We demonstrate that the DGI-MOS biosensor allows the underlap region length to be comparable with the gate electrode length, simplifying the manufacturing steps involved in creating the underlap region.
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漏侧栅极下盖I-MOS (DGI-MOS)晶体管作为无标记生物传感器,用于检测带电生物分子
电子设备作为生物传感器越来越多地应用于生物分子的无标签检测。这些生物传感器具有快速检测和与现有CMOS工艺兼容的优势,可以实现快速商业化,并实现非常低的检测极限。生物传感器的灵敏度是决定其性能的主要因素之一。新兴的陡峭亚阈值器件作为生物传感器的应用正在积极探索,因为它们能够提供非常高的灵敏度。在本文中,我们提出了一种漏极侧栅极下盖冲击电离MOS (DGI-MOS)晶体管作为无标记检测带电生物分子的传感器。DGI-MOS生物传感器是通过在漏侧通道区域的栅极电极上引入一个underlap来实现的。下包是生物分子固定的位置。通过TCAD模拟,我们证明了所提出的DGI-MOS生物传感器对带电生物分子的存在具有高灵敏度。此外,由于生物分子的存在而观察到的阈值电压(VT)移位明显高于其他报道的基于亚阈值器件的生物传感器。我们证明了DGI-MOS生物传感器允许下覆盖区域长度与栅极长度相当,简化了创建下覆盖区域所涉及的制造步骤。
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