Metal-Ceramic Nanocomosite for Radiation Shielding of Electronics

O. Khasanov, E. Dvilis, M. Petyukevich, I. Shamanin
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Abstract

Full dense llightweight nanostructured metal-ceramic composite has been developed for the purpose of radiation shielding of electronic components exposed to radiation flows of electrons, ions, γ-rays, neutrons. The composite consisted of AMg6 (77.9 vol%) +B4C (18.8 vol%)+W (3.3 vol%) was sintered by the SPS method up to 100% density at 490°C / 40 MPa. The microhardness of this composite was 419.9 HV; Young modulus was 98620 N/mm2; creep under indentation was 1.45%. The attenuation coefficient of the developed composite for γ-rays was 1.34 times more in comparison with the pure AMg6 alloy; the attenuation coefficient for thermal and superthermal neutrons was 2.2 times more.
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电子器件辐射屏蔽用金属-陶瓷纳米复合材料
全密度轻量化纳米结构金属-陶瓷复合材料被开发用于电子元件暴露于电子、离子、γ射线、中子的辐射流中的辐射屏蔽。该复合材料由AMg6 (77.9% vol%)+ B4C (18.8 vol%)+W (3.3 vol%)组成,在490℃/ 40 MPa下采用SPS法烧结至100%密度。该复合材料显微硬度为419.9 HV;杨氏模量为98620 N/mm2;压痕下蠕变为1.45%。制备的复合材料对γ射线的衰减系数是纯AMg6合金的1.34倍;热中子和过热中子的衰减系数是前者的2.2倍。
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