Chapter 1 Introduction

D. Edgell, Maria DelMastro Allen, Ginger Smith, Jason R. Swanson
{"title":"Chapter 1 Introduction","authors":"D. Edgell, Maria DelMastro Allen, Ginger Smith, Jason R. Swanson","doi":"10.1520/ds51hol20200001","DOIUrl":null,"url":null,"abstract":"Polysilicon TFT is the key building block for active matrix liquid crystal display (AMLCD) and active matrix organic light emitting diode (AMOLED) due to its faster switching characteristics and high driving current. Its fabrication is similar to the conventional MOSFET process flow and the most difference is the processing temperature. The maximum temperature limited in MOSFETs is about the silicon melting-point, and the temperature in polysilicon TFT fabrication should be less than 600-650 C, due to the commercial considerations that we can processing all fabrications on the cheaper substrate materials such as the glass or the plastic. Low-temperature-polysilicon technology is developed for this reason.","PeriodicalId":270364,"journal":{"name":"The ASTM Computer Program for Chemical Thermodynamic and Energy Release Evaluation - Chetah® Version 11.0","volume":"84 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The ASTM Computer Program for Chemical Thermodynamic and Energy Release Evaluation - Chetah® Version 11.0","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1520/ds51hol20200001","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Polysilicon TFT is the key building block for active matrix liquid crystal display (AMLCD) and active matrix organic light emitting diode (AMOLED) due to its faster switching characteristics and high driving current. Its fabrication is similar to the conventional MOSFET process flow and the most difference is the processing temperature. The maximum temperature limited in MOSFETs is about the silicon melting-point, and the temperature in polysilicon TFT fabrication should be less than 600-650 C, due to the commercial considerations that we can processing all fabrications on the cheaper substrate materials such as the glass or the plastic. Low-temperature-polysilicon technology is developed for this reason.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
第一章引言
多晶硅TFT由于其更快的开关特性和高驱动电流,是有源矩阵液晶显示器(AMLCD)和有源矩阵有机发光二极管(AMOLED)的关键组成部分。其制造过程与传统的MOSFET工艺流程相似,最大的区别是加工温度。mosfet的最高温度限制是硅的熔点,多晶硅TFT制造的温度应低于600-650℃,因为出于商业考虑,我们可以在更便宜的衬底材料(如玻璃或塑料)上加工所有制造。低温多晶硅技术就是为此而发展起来的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Chapter 5 | User Defined Groups (Private Database) Chapter 6 | Thermodynamic Tables Chapter 4 | CHETAH Database Chapter 10 | Flammability Chapter 9 | Reaction Thermochemistry
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1