Nan Liu, Lining Sun, Peng Jin, Jie Lin, Jiubin Tan
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引用次数: 0
Abstract
An optimizing method of vapor-phase depositing anti-adherence layer in UV-embossing through controlling temperature is proposed to enhance the quality of demolding process. Experimental results show that, under low deposited temperature, the quality of anti-adherence layer is better than that under high temperature. Under low temperature, the contact angle of water, methylene iodide, and formamide is 119°, 101°, and 105°, and surface free energy is 8.5mJ/m2, which is similar to its ideal value. Film thickness is equal to its molecule length. XPS experiments mean that monolayer under low temperature is more orderly than that under high temperature. And crack character of low temperature is also better than that of high temperature.
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