NBTI Degradation: A Problem or a Scare?

K. Saluja, Shriram Vijayakumar, Warin Sootkaneung, Xaingning Yang
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引用次数: 35

Abstract

Negative bias temperature instability (NBTI) has been identified as a major and critical reliability issue for PMOS devices in nano-scale designs. It manifests as a negative threshold voltage shift, thereby degrading the performance of the PMOS devices over the lifetime of a circuit. In order to determine the quantitative impact of this phenomenon an accurate and tractable model is needed. In this paper we explore a novel and practical methodology for modeling NBTI degradation at the logic level for digital circuits. Its major contributions include i) a SPICE level simulation to identify stress on PMOS devices under varying input conditions for various gate types and ii) a gate level simulation methodology that is scalable and accurate for determining stress on large circuits. We validate the proposed logic level simulation methodology by showing that it is accurate within 1% of the reference model. Contrary to many other papers in this area, our experimental results show that the overall delay degradation of large digital circuits due to NBTI is relatively small.
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NBTI退化:问题还是恐惧?
负偏置温度不稳定性(NBTI)已被确定为PMOS器件在纳米级设计中主要和关键的可靠性问题。它表现为负阈值电压移位,从而降低了PMOS器件在电路寿命期间的性能。为了确定这一现象的定量影响,需要一个准确和易于处理的模型。在本文中,我们探索了一种新颖实用的方法来模拟数字电路的逻辑级NBTI退化。其主要贡献包括i) SPICE级仿真,用于识别各种栅极类型的PMOS器件在不同输入条件下的应力;ii)栅极级仿真方法,可扩展且准确地确定大型电路的应力。我们通过表明它在参考模型的1%以内的精度来验证所提出的逻辑级仿真方法。与该领域的许多其他论文相反,我们的实验结果表明,由于NBTI导致的大型数字电路的总体延迟退化相对较小。
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