Plated Source Bridge (PSB) GaAs Power FET with Improved Reliability

T. Suzuki, M. Kobiki, M. Wataze, K. Segawa, M. Irie
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引用次数: 2

Abstract

Flip chip type GaAs power FET having a plated source bridge (PSB) structure has been developed. Thermal resistance is improved by 2 /spl deg/ C/W for a device with total gate width of 2400 mu. This improvement results in 2 times increase of the device MTTF. At the channel temperature of 150 /spl deg/ C, MTTF more than 10 /sup 7/ hours is estimated by accelerated operation life tests.
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具有提高可靠性的镀源桥(PSB) GaAs功率场效应管
开发了一种具有镀源桥(PSB)结构的倒装片型GaAs功率场效应管。对于总栅极宽度为2400亩的器件,热阻提高了2 /spl度/ C/W。这种改进使设备的MTTF提高了2倍。在通道温度为150 /spl°C时,通过加速运行寿命试验估计MTTF大于10 /sup 7/ h。
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