M.F. Davis, A. Sutono, A. Obatoyinbo, Sandip Chakraborty, K. Lim, S. Pinel, J. Laskar, S. Lee, R. Tummala
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引用次数: 15
Abstract
Presents the design, and measurement of RF-microwave multilayer interconnects and integrated passives implemented in a fully-organic system on package(SOP) technology. A CPW-microstrip interconnect scheme demonstrates a measured insertion loss of 1.7 dB at 12 GHz and a return loss better than 20 dB to 12 GHz. The novel hollow ground plane inductor configuration exhibits Q and effective inductance(Leff) enhancement by a factor of 2.5 and 2, respectively with SRF to 14 GHz. In addition, compact filters have also been designed for Optical Sub-Carrier Multiplexing(OSCM) link applications. These developments suggest the feasibility of building highly integrated organic-based radio front-end SOP.
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