Low-frequency noise in UHV/CVD Si- and SiGe-base bipolar transistors

L. Vempati, J. Cressler, J. Babcock, R. Jaeger, D. Harame
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引用次数: 15

Abstract

In this work we present the first comprehensive investigation of the low-frequency noise characteristics of an advanced epitaxial Si- and SiGe-base bipolar technology grown by the UHV/CVD technique. The magnitude of the 1/f noise is comparable for SiGe HBTs and Si BJTs for identical bias, geometry, and temperature, indicating that the use of thermodynamically stable SiGe strained-layers does not degrade transistor noise performance. In some of the Si and SiGe samples we have observed random telegraph signals (RTS) associated with excess generation-recombination (G/R) noise. Temperature measurements have been made to extract activation energies of the associated G/R centers.
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UHV/CVD硅基和硅基双极晶体管中的低频噪声
在这项工作中,我们首次全面研究了由UHV/CVD技术培养的先进外延硅基和硅基双极技术的低频噪声特性。在相同的偏置、几何形状和温度下,SiGe HBTs和Si bjt的1/f噪声大小是相当的,这表明使用热力学稳定的SiGe应变层不会降低晶体管的噪声性能。在一些Si和SiGe样品中,我们观察到随机电报信号(RTS)与过量的产生-重组(G/R)噪声相关。通过温度测量来提取相关G/R中心的活化能。
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