Noise Analysis of Current Sensor for Medium Voltage Power Converter Enabled by Silicon-Carbide MOSFETs

Morten Rahr Nielsen, Mathias Kirkeby, Hongbo Zhao, D. Dalal, Michael Møller Bech, S. Munk‐Nielsen
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引用次数: 2

Abstract

New semiconductor devices based on wide bandgap materials are emerging in medium voltage power electronic converter applications, presenting new opportunities to the industry relying on semiconductor devices. SiC MOSFETs with blocking voltages of 10 kV (and above) is a promising technology, however, their fast switching transitions result in increased output voltage slew rate (dv/dt), which poses challenges to the applicability of the SiC MOSFET technology. This paper examines the impact of the increased dv/dt on the applicability of an off-the-shelf closed loop hall-effect current sensor when utilized in a medium voltage SiC MOSFET based power electronics converter. Analysis of the capacitive couplings in the current sensor is presented along with an experimental determination of the parasitic capacitance between its primary conductor and secondary winding. Experimental measurements have identified two distinct noise components in the current sensor measurement path due to: 1) capacitive coupling between the primary conductor and secondary winding, and 2) an inferred capacitive coupling into the active circuitry of the current sensor.
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碳化硅mosfet使能中压功率变换器电流传感器噪声分析
基于宽禁带材料的新型半导体器件在中压电力电子变换器应用中不断涌现,为依托半导体器件的产业带来了新的机遇。阻塞电压为10 kV(及以上)的SiC MOSFET是一种很有前途的技术,然而,它们的快速开关转换导致输出电压转换率(dv/dt)增加,这对SiC MOSFET技术的适用性提出了挑战。本文研究了在基于中压SiC MOSFET的电力电子转换器中使用现成的闭环霍尔效应电流传感器时,增加dv/dt对其适用性的影响。对电流传感器中的电容耦合进行了分析,并对其初级导体和次级绕组之间的寄生电容进行了实验测定。实验测量已经确定了电流传感器测量路径中的两种不同的噪声成分,这是由于:1)初级导体和次级绕组之间的电容耦合,以及2)推断电容耦合到电流传感器的有源电路中。
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